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Optimize MES intelligence in semiconductor advanced packaging

SmartFactory MES for ATP brings die tracking and traceability, material consumption history to the fan-out process

Semiconductor advanced packaging has become critical in the development of next-generation devices. As technology advances, conventional packaging approaches face limitations in terms of size, performance, and power consumption. Advanced packaging addresses these challenges by offering increased functionality, smaller packages for improved performance, lower power consumption, and enhanced reliability.

Recent innovations in advanced packaging technologies are notable – particularly in fan-out packaging, which has rapidly been gaining popularity due to its versatility and scalability. Fan-out packaging allows heterogeneous integration of multiple semiconductor devices, such as processors, sensors, and high bandwidth memory (HBM), in a single, high-performance package. And it offers increased flexibility in terms of design and form factor, enabling smaller modules with increased functionality at reduced cost.

In this blog, we’ll explore two key use cases highlighting how the MES can optimize the fan-out packaging process.

Use case #1 – die tracking

Problem description

During the fan-out packaging process, when multiple die are attached to a substrate, it’s important to model which dies are attached to which location and in what order, as shown in figure 1, below. Since many different die can be attached to a single substrate location, configuring the precise die-attachment sequence is critical.
Figure 1: Multiple die on a substrate
Figure 1: Multiple die on a substrate
The SmartFactory MES for ATP provides a flexible modeling method to define the right die and the right attachment sequence in advance at each step, as shown in figure 2.
Figure 2: Setup UI for defining die attach specification
Figure 2: Setup UI for defining die attach specification

Benefits

The SmartFactory MES for ATP allows customers to model and track how die are attached to a substrate, improving operational efficiency by mistake-proofing run-time operation. Additionally, pre-defined automation scenarios minimize the equipment automation integration effort.

Use case #2 – die traceability

Problem description

The fan-out process significantly increases the complexity of determining the number and sequence of die attached at each substrate location. Traceability is necessary to track which die are consumed on each substrate. Flexible reporting tools are also necessary to allow users to easily view and evaluate die consumption history.

The SmartFactory MES for ATP can report which die were consumed for which assembly lot. Figure 3 below shows how users can see the product IDs of die consumed by an assembly lot.

Figure 3: Report showing the die on an assembly lot
Figure 3: Report showing the die on an assembly lot

Users can also see die consumption by work order (see figure 4) and determine the consumed die quantity by substrate ID.

Figure 4: Report showing die consumption by work order
Figure 4: Report showing die consumption by work order

Benefits

The SmartFactory MES for ATP provides comprehensive traceability reporting for both consumed die quantity and die/substrate location. No matter the product – from AI processors to HBM modules – the solution provides thorough and accurate information that’s explicitly curated to reduce root cause discovery time and minimize the impact of issues that arise during manufacturing.

Summary

The SmartFactory MES for ATP:
  • Allows modeling die attachment location and sequence in a substrate. This, in turn, enables comprehensive and accurate traceability of die, substrates, and lots throughout the fan-out process.
  • Provides comprehensive traceability of consumed material, manufacturing durables usage, process genealogy, and equipment utilization and maintenance, ensuring both visibility and auditability of manufacturing operations.
  • Tracks lot movements, monitors production progress, and ensures accurate data synchronization between the MES and equipment automation throughout the fan-out process.

Next Steps

Semiconductor advanced packaging is a revolutionary and rapidly evolving technology. We invite you to join us in exploring this technology – and in learning about how the innovations in the SmartFactory MES for ATP address many advanced packaging use cases. In our next blog, we’ll discuss how the solution can enable full automation in advanced packaging factories.

Ready to learn more about the Applied SmartFactory MES for ATP? Connect with us here.

About the Author

Picture of Seong Hoon Lee, Global Product Manager, MES 300works® and FACTORYworks®
Seong Hoon Lee, Global Product Manager, MES 300works® and FACTORYworks®
Seong Hoon Lee is an experienced Global Product Manager for SmartFactory 300works and FACTORYworks, with more than 25 years’ experience in semiconductor front-end, back-end, and display, as well as experience in the solar industry. He has held various roles, including software engineer, solution architect and industry segment manager in Manufacturing Execution Systems. Seong Hoon earned his bachelor’s degree in Industrial Engineering from Myongji University and a Master of Business Administration from Yonsei University.