Semiconductor advanced packaging has become critical in the development of next-generation devices. As technology advances, conventional packaging approaches face limitations in terms of size, performance, and power consumption. Advanced packaging addresses these challenges by offering increased functionality, smaller packages for improved performance, lower power consumption, and enhanced reliability.
Recent innovations in advanced packaging technologies are notable – particularly in fan-out packaging, which has rapidly been gaining popularity due to its versatility and scalability. Fan-out packaging allows heterogeneous integration of multiple semiconductor devices, such as processors, sensors, and high bandwidth memory (HBM), in a single, high-performance package. And it offers increased flexibility in terms of design and form factor, enabling smaller modules with increased functionality at reduced cost.
In this blog, we’ll explore two key use cases highlighting how the MES can optimize the fan-out packaging process.
Use case #1 – die tracking
Problem description
Benefits
The SmartFactory MES for ATP allows customers to model and track how die are attached to a substrate, improving operational efficiency by mistake-proofing run-time operation. Additionally, pre-defined automation scenarios minimize the equipment automation integration effort.
Use case #2 – die traceability
Problem description
The fan-out process significantly increases the complexity of determining the number and sequence of die attached at each substrate location. Traceability is necessary to track which die are consumed on each substrate. Flexible reporting tools are also necessary to allow users to easily view and evaluate die consumption history.
The SmartFactory MES for ATP can report which die were consumed for which assembly lot. Figure 3 below shows how users can see the product IDs of die consumed by an assembly lot.
Users can also see die consumption by work order (see figure 4) and determine the consumed die quantity by substrate ID.
Benefits
Summary
- Allows modeling die attachment location and sequence in a substrate. This, in turn, enables comprehensive and accurate traceability of die, substrates, and lots throughout the fan-out process.
- Provides comprehensive traceability of consumed material, manufacturing durables usage, process genealogy, and equipment utilization and maintenance, ensuring both visibility and auditability of manufacturing operations.
- Tracks lot movements, monitors production progress, and ensures accurate data synchronization between the MES and equipment automation throughout the fan-out process.
Next Steps
Semiconductor advanced packaging is a revolutionary and rapidly evolving technology. We invite you to join us in exploring this technology – and in learning about how the innovations in the SmartFactory MES for ATP address many advanced packaging use cases. In our next blog, we’ll discuss how the solution can enable full automation in advanced packaging factories.
Ready to learn more about the Applied SmartFactory MES for ATP? Connect with us here.