Chiplet-based architectures
Rather than building monolithic systems-on-chips (SoCs), manufacturers are now assembling modular chiplets—each optimized for a specific function—into a single package. This approach improves yield, reduces cost, and accelerates time-to-market. However, it also creates several challenges such as heterogeneous process flows across different nodes and materials, the need for die-to-die interconnect validation, and advanced packing and test requirements.
To overcome these challenges, manufacturers require solutions that can manage the intricacies of chiplet assembly while maintaining high yield and quality standards. Ideally, solutions should be based on a flexible manufacturing execution system (MES) platform that supports high-mix, low-volume production environments. SmartFactory PROMIS is one such solution. Among its features are essential recipe management and traceability tools that can be tailored for multi-die workflows. Additionally, real-time analytics and scheduling engines optimize throughput, even across diverse process steps.
3D integration and advanced packaging
- Automated inspection workflows for stacked dies
- Run-to-run control systems that adapt recipes based on feedback
- Integrated fault detection and classification (FDC) to identify anomalies early
Sustainability Initiatives
It’s no secret that semiconductor manufacturing is resource intensive, consuming large amounts of water, energy, and chemicals. With tightening environmental regulations and environmental, social and governance (ESG) goals, fabs are under pressure to reduce their footprint while maintaining production and quality.
Increased automation affords manufacturers the ability to monitor and control systems and processes that impact sustainability. For example, energy and resource optimization modules help fabs monitor and control facility usage. Predictive maintenance tools reduce waste and downtime, while simulation modeling enables them to evaluate the environmental impact of process changes. By integrating sustainability metrics into its automation stack, SmartFactory enables fabs to make data-driven decisions around both operational and environmental objectives.
Integration across the value chain
Chiplet and 3D manufacturing rely on collaboration between design houses, foundries and packaging providers. Solutions that can integrate across these key partners offer the benefits of increased communication and collaboration and, ultimately, efficiency. SmartFactory’s portfolio supports integration across the semiconductor ecosystem—whether in front-end wafer fabrication or back-end assembly and test. Its unified automation framework enables essential functions such as tool-to-tool communication, supply chain visibility, and secure data exchange. It also supports digital twin technology, allowing fabs to simulate process flows and identify bottlenecks without disrupting production—a critical capability in fast-moving markets like AI, automotive, and consumer electronics.
Looking ahead
As semiconductor manufacturing grows more complex and interconnected, automation platforms must evolve from static process control systems to dynamic, intelligent ecosystems.
SmartFactory is ready to address these growing needs. Its modular architecture adapts to emerging technologies while AI-driven analytics enable predictive and prescriptive decision-making. By supporting chiplet integration, 3D stacking, and sustainability, SmartFactory helps fabs stay agile, competitive, and ready for the future.
No single platform can address every challenge in semiconductor manufacturing, but SmartFactory offers the tools to modernize operations today—and scale for tomorrow’s innovations.
